Numerical Investigation on Heat Sink Material for Temperature Control of Electronics

 Introduction:

 

The advancement of technology has led to the development of electronic devices that are becoming increasingly complex and powerful. However, with this increase in power comes an increase in heat generation, which can lead to device failure if not managed properly. This is where heat sink materials come into play. In this blog, we will discuss the findings of a recent study titled "Numerical Investigation on Heat Sink Material for Temperature Control of Electronics" and how it contributes to the field of thermal management.

Background:

 

The study was conducted by Shankar Durgam, Bharati Ghodake, and Suhas Mohite from the Department of Mechanical Engineering at the College of Engineering Pune in India. The researchers investigated different heat sink materials for their effectiveness in enhancing heat transfer and cooling electronic devices. The cooling medium used for analysis was water.

Findings:

The study found that advanced heat sink materials can significantly enhance heat transfer and improve thermal management in electronic devices. The researchers tested various materials such as copper and aluminum and found that aluminum had the highest thermal conductivity among them. This means that it can transfer heat more efficiently than other materials. Simulations were conducted on Ansys, and various experiments were conducted with the materials aluminum and copper to check their conductivities. Pressure and temperature contours were plotted to show effective results.

  

                                                 Pressure and temperature contours of Copper alloy

         

                                             Pressure and temperature contours of Al6060

        
                                                      Pressure and temperature contours of Al6063

                                                    

Implications:

The findings of this study have significant implications for the field of thermal management. Electronic devices are becoming more powerful and compact, which means that they generate more heat per unit volume than ever before. Therefore, it is crucial to develop effective cooling solutions to prevent device failure due to overheating. Advanced heat sink materials such as graphite foam can provide a breakthrough solution to this problem by enhancing heat transfer efficiency and improving thermal management. This can lead to the development of more powerful and efficient electronic devices that can operate at higher temperatures without the risk of failure.

Conclusion: 

In conclusion, the study "Numerical Investigation on Heat Sink Material for Temperature Control of Electronics" provides valuable insights into the effectiveness of different heat sink materials for thermal management. The findings of this study have significant implications for the development of more powerful and efficient electronic devices. The material Al6060 is more advantageous with respect to its cost, weight, and machining time compared to other aluminum and copper alloys. Thus, advanced heat sink materials such as Al6060 can provide a breakthrough solution to the problem of overheating in electronic devices.

References:

https://www.matec-conferences.org/articles/matecconf/pdf/2018/30/matecconf_e3pe2018_02003.pdf

https://en.wikipedia.org/wiki/Heat_sink

https://www.researchgate.net/

https://www.researchgate.net/publication/357648138

Blog Credits:

Bhakti Gujarathi 

S.Y. Manufacturing